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ACS-2332 ACS-2332
ACS-2332
ACS-2332
Embedded PCs

ACS-2332 APLEX embedded computer

Processor: Intel 6th/7th Gen. Skylake/Kaby Lake CoreTM i7/i5/i3 CPU
RAM: 2 x SO-DIMM, expandable up to 32GB
Hard drive: Easily accessible drive bay
Resolution: Support 4K UHD
Mini PCIe: 3 slots full size
PCIe: 2 slots
Specifications

Technical specifications ACS-2332

Parameters
Processor
Intel 6th/7th Gen. Skylake/Kaby Lake CoreTM i7/i5/i3 CPUs with 35W TDP support
Frequency, MHz
1.70 GHz/2.00 GHz
Max. resolution
4K UHD
Chipset
Intel H170 Chipset
Maximum possible RAM capacity, MB
32
Type of RAM
2 x 260-pin SO-DIMM slot expandable up to 32GB DDR4 1866/2133 MHz
Pre-installed storage, GB
320
Hard disc, GB
2 x 2.5, RAID 0,1 support
Drive type
HDD
Space for hard drives
2
Drive interface
SATA3
Interfaces
USB host
4 x USB 3.0 type A, 2 x USB 2.0 type A
Ethernet
4 x GbE LAN RJ-45
Serial interface
2 x RS-232/422/485 DB-9, COM1/COM2, default RS-232

2 x RS-232 DB-9, COM3/COM4
PCI
3 x Mini PCIe slots full size (one slot combined with mSATA), 2 x PCIe x1 slo
VGA port
1
HDMI
1 x Display port, 1 x DVI-I, 1 x HDMI
Audio
1 x Line-in, 1 x Line-out, 1 x Mic ( 3.5 jack )
Power connector
3-pin lockable, illuminated push-button switch
Design
Housing material
Aluminium radiator, metal housing
Degree of protection of the front panel
IP20
Dimensions (L*W*H), mm
280 x 230 x 134.6
Weight (net), kg
5.5
Wall mounting
on the wall / DIN rail (optional)
Software
Operating system
Windows Embedded 8.1 Industry Pro, Windows Embedded 8 Standard, Windows 10 IOT 2016
Operation and storage
Operating temperature, ℃
0~50°C / -20~60°C
Storage temperature, ℃
-30~70 °C
Current consumption
MAX: 60.4W
Power supply voltage
9-36V DC
Relative humidity, % (non-condensing)
10%~90%@ 40°C (non-condensing)
Certificates
CE / FCC Class A